SISPAD 2026 Will Be Held as Scheduled in Kumamoto

Posted: August 10, 2026 (JST). This notice updates the notice posted on July 29, 2026.

Following the earthquake that struck Kumamoto Prefecture on July 28, 2026, the SISPAD 2026 Organizing Committee has been confirming the status of the conference venues and the surrounding area. We are now able to share the following update.

SISPAD 2026 will be held as scheduled: the Workshop on Sunday, September 27, 2026 at the Kumamoto City International Center, and the main conference from Monday, September 28 to Wednesday, September 30, 2026 at Kumamoto-Jo Hall.

Both venues have completed their safety inspections and have returned to normal operation, with no damage that would affect the conference. Transportation to and within Kumamoto is generally operating as usual, including Kumamoto Airport, the Kyushu Shinkansen between Fukuoka and Kumamoto, and local trams and buses. A large number of hotels in the city are also open and operating normally.

Recovery in the affected areas is still ongoing, and our thoughts remain with everyone in the region. We are grateful to the local organizations that have supported our preparations while dealing with the aftermath themselves, and we look forward to welcoming you to Kumamoto.

Registration: Early-bird registration and registration for presenters close at 17:00 (JST) on Friday, August 14, 2026. Please complete your registration by this deadline.

Should the situation change, we will update this page promptly. If you have any questions regarding your participation, please contact the secretariat at secretariat@sispad2026.jp.

SISPAD 2026 Organizing Committee

September 28 – 30, 2026
Workshop, September 27
Kumamoto, JAPAN

2026 International Conference on Simulation of
Semiconductor Processes and Devices (SISPAD2026)

WELCOME TO SISPAD2026

International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures. SISPAD2026 will be held in-person in Kumamoto, Japan, from September 28 to 30, 2026.
A satellite workshop will be offered on the day before the main conference starts (Sunday, September 27). Details on the SISPAD2026 technical program and workshop will be announced here as soon as they are available.

We hope to see you in Kumamoto in September.

SISPAD2026 Committee

IMPORTANT DATES

Late January 2026

 Abstract submission site opens

April 10, 2026 April 22, 2026

 Abstract Submission Deadline is extended

June 30, 2026

 Final Paper Submission Deadline

July 31, 2026 August 14, 2026

 Early-bird Registration Deadline is extended

August 28, 2026

 Late Registration Deadline

September 27, 2026

 Workshop

September 28, 2026

 Main conference starts

NEWS

July 7, 2026 New Plenary Speakers page is now available.
July 3, 2026 Visa Support Application is now open.
June 5, 2026 Workshop page is now available.
June 3, 2026 Final Paper Submission is now open.
June 1, 2026 Online Registration is now open.
April 7, 2026 Abstract Submission Deadline is extended.
January 30, 2026 Abstract Submission is now open.
January 8, 2026 Call for Papers is now available.
December 5, 2025 Web site opened.